Powder Glue for heat transfers & bonding materials
We offer two standard qualities of powder glue.
QZN : Most commonly used. Temperatures from 140 to 220 degrees C.
QZSP : Used for low temperature applications. It will bond to synthetic materials from 110
degrees C. When transfering on sublimation printed materials, no vapours occur at
low temperatures, so there is no colouring effect on the transfer.
Grain size 80 to 200 microns.
Easy to apply
Sacks of 5 and 20Kg
Information on this page is subject to change without any notice.
Please feel free to contact us in case you need further assistance.
Very strong bonding